Sintering Molybdenum Bar - 99.95 Molybdenum Pure Molybdenum Product Moly Sheet Moly Plate Moly Foil In High Temperature Furnaces And Associated Equipment – HSG Metal
Sintering Molybdenum Bar - 99.95 Molybdenum Pure Molybdenum Product Moly Sheet Moly Plate Moly Foil In High Temperature Furnaces And Associated Equipment – HSG Metal Detail:
Product Parameters
| Item | molybdenum sheet/plate |
| Grade | Mo1, Mo2 |
| Stock size | 0.2mm, 0.5mm, 1mm, 2mm |
| MOQ | hot rolling, cleaning, polished |
| Stock | 1 kilograms |
| Property | anti-corrosion, high temperature resistance |
| Surface Treatment | Hot-rolled alkaline cleaning surface |
| Electrolytic polish surface | |
| Cold-rolled surface | |
| Machined surface | |
| Technology | extrusion, forging and rolling |
| Test and Quality | dimension inspection |
| appearance quality test | |
| process performance test | |
| mechanical properities test | |
| The specification would be changed by the customers’ requirements. | |
Specification
| Width, mm | Thickness, mm | Thickness deviation, min, mm | Flatness, % | |||
| <300mm | >0.13mm | ±0.025mm | 4% | |||
| ≥300mm | >0.25mm | ±0.06mm | 5%-8% | |||
| Purity(%) | Ag | Ni | P | Cu | Pb | N |
| <0.0001 | <0.0005 | <0.001 | <0.0001 | <0.0001 | <0.002 | |
| Si | Mg | Ca | Sn | Ba | Cd | |
| <0.001 | <0.0001 | <0.001 | <0.0001 | <0.0003 | <0.001 | |
| Na | C | Fe | O | H | Mo | |
| <0.0024 | <0.0033 | <0.0016 | <0.0062 | <0.0006 | >99.97 | |
Specification
| Specifications for molybdenum wire: | ||
| Molybdenum Wire Types | Diameter (inch) | Tolerance (%) |
| Molybdenum Wire for EDM | 0.0024″ ~ 0.01″ | ±3% wt |
| Molybdenum Spray Wire | 1/16″ ~ 1/8″ | ±1% to 3% wt |
| Molybdenum Wire | 0.002″ ~ 0.08″ | ±3% wt |
| Molybdenum Wire(clean) | 0.006″ ~ 0.04″ | ±3% wt |
Specificantions Range
1) Thickness: Hot-rolled plate:1.5~40mm; Cold-rolled plate/sheet:0.05~3.0mm
2) Width: Hot-rolled plate:≤750mm; Cold-rolled plate/sheet: ≤1050mm;
3) Length: Hot-rolled plate:≤3500mm; Cold-rolled plate/sheet: ≤2500mm
Application
| Classification | Feature | Application field |
| Pure Mo plate | High melting point, high purity, low thermal expansivity, excellent thermal conductivity, welding performance and processability | Widely used for manufacturing electron (ion) beam sputtering target, spare parts for ion implantation machine, heat sink of semiconductor, parts of electron tube, MOCVD equipment, and medical device, hot zone, crucible and supporting elements for sapphire crystal furnace, heater, heat shield, supporting element, and boat for vacuum and hydrogen shielded heating furnace |
| Pure Mo plate treated in high temperature | High-purity, consistent in physical and chemical property, and excellent high temperature anti-deforming capability | Suitable for manufacturing base plate for precision electronic ceramics and rear-earth material |
| Lanthanum-doped Mo plate | By using oxide dispersion strengthening mechanism, certain plastic deformation could be performed under room temperature after being treated in high temperature because of its high strength, high recrystallization temperature and excellent high-temperature strength and improved recrystallization brittleness and high temperature anti-deforming capability | particularly suitable for fabricating components used in more than 1500℃ work environment, such as heater, heat shield, base plate and boat for high temperature furnace |
| Lanthanum-doped Mo plate treated in high temperature | Excellent high-temperature strength, and low high temperature deformation due to its oxide dispersion strengthening effect and specific structure | suitable for making base plate for sintering fine ceramics and rear-earth ceramic, bearing rack, base plate and coat for high temperature heating furnace |
| Doped Mo plate | High temperature strength, low recrystallization temperature, and excellent high-temperature creep resistant performance because of its potassium bubble strengthening mechanism | particularly suitable for fabricating products with low high-temperature creep, such as components for electron tube, heater, heat shield, and so on for high temperature furnace |
| Doped Mo plate treated in high temperature | Low high-temperature creep due to its long grain staggered structure and high purity | suitable for making products with high requirement to purity and high-temperature creep, such as base plate for electronic ceramics sintering or heat-treating, supporting elements in electron tube, and so on |
| Cross-rolled pure Mo plate | Low anisotropy and good bending performance | particularly suitable for elongating, spinning, reinforcing and bending, and making elongating or spinning Mo crucible, Mo parts need to reinforce or bend, such as corrugated sheet, bending piece, Mo boat, and so on |
| Cross-rolled pure Mo plate treated in high temperature | Low anisotropy and good bending performance besides same performance of Lanthanum-doped Mo plate | particularly suitable for reinforcing and bending, and making reinforced or bended Mo parts with high temperature requirement, such as heating zone, bended fabricated parts, high-temperature Mo boat, and so on |
Product detail pictures:
Related Product Guide:
We strive for excellence, service the customers", hopes to become the best cooperation team and dominator enterprise for personnel, suppliers and customers, realizes value share and continuous promotion for Sintering Molybdenum Bar - 99.95 Molybdenum Pure Molybdenum Product Moly Sheet Moly Plate Moly Foil In High Temperature Furnaces And Associated Equipment – HSG Metal , The product will supply to all over the world, such as: Qatar, Singapore, Orlando, We expect to provide products and services to more users in global aftermarket markets; we launched our global branding strategy by providing our excellent products all over the world by virtue of our well reputed partners letting global users keep pace with technology innovation and achievements with us.
By Ivy from Chile - 2018.06.18 19:26
The factory technical staff not only have high level of technology, their English level is also very good, this is a great help to technology communication.
By Yannick Vergoz from Victoria - 2018.06.09 12:42
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